Recommendations for Usage of Materials in Process Liquids

 Additional
Treatment Liquids
 
Process Solution
GL
QS
S3
SS
TI
SA
L
ABS pickle (CrO3/H2SO4) x + - - - O x
  Aluminium pickling bath, containing fluoride - O - - - - X
Ammonium fluoride (NH4F) - O - - - - X
Ammonium chloride = flux bath (NH4CI) X + - - + O +
Bleaching solution = sodium hypochlorite (NaCIO) + + - - O + X
Borax bath (Na2B4O7 ˇ 10H2O) O + X O - X +
Chromatizing bath (H3PO4/ CrO3/H2SO4), fluoride-free X + - - - + X
Pickle bath (HCI &/or H2SO4), fluoride-free X + - - O - X
Iron III chloride solution (FeCI3) X + - - X - +
Photogaphic developer X + O - X O O
Photographic fixer O O - - X O O
Gloss bath, chemical (H3PO4 + HNO3) O X O - - + X
Potassium permanganate, with water (KMnO4) + + X - X + +
Sodium chloride solution (containing NaCI) X + - - X - +
Solder liquid, acidic (containing HCI) X + - - - - +
Sodium sulphate (Na2SO4 ˇ 10H2O) O + X - X + +
Phosphate bath (iron / zinc phosphate) - - O O - X O
Black bath (HNO3 + FeCI3) X + - - X O X
Sealing bath = desalinated water X + X - + + +
Hydrogen peroxide (H2O2) X + O - O X X